3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
Electronics Forum | Thu Oct 16 07:23:36 EDT 2008 | rway
Hello, Does anyone know anything about this system? We currently use YesTech M1 AOI but are looking into this machine. Particularly the model 7301. Any insight you can provide as far as performance compared to YesTech or just over-all would be gr
Electronics Forum | Sun Oct 26 09:24:17 EDT 2008 | tony_d
Hello Reese, You may want to check out MIRTEC's MV-7 machine. It is simple to use, like your YESTech M1 (we looked at YESTech before selecting MIRTEC). But unlike the M1, the MIRTEC MV-7 has five 2 meg cameras, and a laser inspection option as wel
Used SMT Equipment | AOI / Automated Optical Inspection
This item is included in our July 5-10 Online SMT Auction. Please select the below link for more details on this sale. http://bajabid.hibid.com/catalog/134859/toggled-july-2018/?q=215
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech M1 Automatic AOI Inspection System Year 2006 SN: V40708680 Calibration Unit
Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Industry News | 2017-06-13 20:13:14.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce plans to exhibit in Booth #5644 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The Nordson Test & Inspection team will showcase a suite of award-winning systems targeted at both the Semiconductor and PCBA markets, including the Quadra™ 7 X-ray Inspection system, M1m AOI system and 4800 Advanced Wafer Testing Bondtester.
